Réduction du gauchissement d’un empilement de couches minces destiné à la fabrication de microcomposants électronique

Abstract

Electronic microcomputers are needed. They are found in most electronic equipment. Today the technique allows a significant reduction of all complex functionalities and with a simplified implementation. The manufacture of microcomposants is based on the stacking of thin layers, the procedure of deposition of a metal and dielectric layer deposited on a silicon substrate in the form of the wafer. The deferential deposition temperatures of the different layers and the differences in coefficients of thermal expansion of the stacking materials lead to the appearance of residual stresses of thermal origin. The level of these stresses is significant and leads to a deformation of the stacking of the buckling type. For ourcase,we work on numerical models with abacus of a simulation allowing to consider the deformed platelets .We studied the effect of the thickness of the material on the level of warping as well as we opted for the clipping of the metal film to reduce deflection. Trimming involves removing part of the metal film. We studied the impact of the width of the trimming on the deflection of the stacking.