UTILISATION DE LA METHODE D’Homogénéisations POUR UNE ANALYSE NUMIRIQUE REPONSE THERMOMECANIQUE D’UN EMPILEMENT DE COUCHE MINCES

Abstract

Among the problems encountered in assemblies of microelectronic components we can cite the residual stresses of thermal origin which are the result of the difference in the coefficients of thermal expansion (CTE) of the materials used. Residual stresses cause failure in the contact areas. The present work includes a numerical approach aiming to estimate the level and the distribution of residual stresses in an electronic microcomponent. The complex structure of the studied microcomponent forced us to use the homogenization method in order to reduce the costs of the calculations. We have studied the impact of reducing the thickness of the solder on the level and distribution of residual stresses.